GIGABYTE B560M DS3H AC (LGA 1200/ Intel/ B560/ Micro-ATX/Dual M.2/ PCIe 4.0/ USB 3.2 Gen1/ GbE LAN/Motherboard)

1. Support for 10th Generation Intel^® Core™ i9 processors/Intel^® Core™ i7 processors/Intel^® Core™ i5 processors/Intel^® Core™ i3 processors/Intel^® Pentium^® processors/Intel^® Celeron^® processors in the LGA1200 package
2. L3 cache varies with CPU

(Please refer “CPU Support List” for more information.)

1. Intel^® B460 Express Chipset

1. Intel^® Core™ i9/i7 processors:
   Support for DDR4 2933/2666/2400/2133 MHz
2. Intel^® Core™ i5/i3/Pentium^®/Celeron^® processors:
   Support for DDR4 2666/2400/2133 MHz
3. 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
4. Dual channel memory architecture
5. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
6. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
7. Support for Extreme Memory Profile (XMP) memory modules

(Please refer “Memory Support List” for more information.)

Integrated Graphics Processor-Intel^® HD Graphics support:

1. 1 x D-Sub port, supporting a maximum resolution of 1920×1200@60 Hz
2. 1 x DVI-D port, supporting a maximum resolution of 1920×1200@60 Hz
   * The DVI-D port does not support D-Sub connection by adapter.
3. 1 x HDMI port, supporting a maximum resolution of 4096×2160@30 Hz
   * Support for HDMI 1.4 version and HDCP 2.3.

Support for up to 3 displays at the same time
Maximum shared memory of 512 MB

1. Realtek^® ALC887 codec
2. High Definition Audio
3. 2/4/5.1/7.1-channel
   * To configure 7.1-channel audio, you need to open the audio software and select Device advanced settings > Playback Device to change the default setting first. Please visit GIGABYTE’s website for details on configuring the audio software.

1. Realtek^® GbE LAN chip (1000 Mbit/100 Mbit)

1. 1 x PCI Express x16 slot, running at x16 (PCIEX16)
2. 2 x PCI Express x1 slots
   (All of the PCI Express slots conform to PCI Express 3.0 standard.)

Supports up to ASPM L1.2 power management protocols.

1. 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280 SATA and PCIe x4/x2 SSD support)
2. 6 x SATA 6Gb/s connectors
3. Support for SATA RAID 0, RAID 1, RAID 5, and RAID 10
   * Refer to “1-7 Internal Connectors,” for the installation notices for the M.2 and SATA connectors.

Intel^® Optane™ Memory Ready
M.2 connectors support up to ASPM L1.2 PCIe power management protocols.

Chipset:

1. 6 x USB 3.2 Gen 1 ports (4 ports on the back panel, 2 ports available through the internal USB header)
2. 2 x USB 2.0/1.1 ports on the back panel

Chipset+USB 2.0 Hub:

1. 4 x USB 2.0/1.1 ports available through the internal USB headers

1. 1 x 24-pin ATX main power connector
2. 1 x 8-pin ATX 12V power connector
3. 1 x CPU fan header
4. 2 x system fan headers
5. 2 x RGB LED strip headers
6. 6 x SATA 6Gb/s connectors
7. 1 x M.2 Socket 3 connector
8. 1 x front panel header
9. 1 x front panel audio header
10. 1 x USB 3.2 Gen 1 header
11. 2 x USB 2.0/1.1 headers
12. 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
13. 2 x serial port headers
14. 1 x Clear CMOS jumper

1. 1 x PS/2 keyboard/mouse port
2. 1 x D-Sub port
3. 1 x DVI-D port
4. 1 x HDMI port
5. 4 x USB 3.2 Gen 1 ports
6. 2 x USB 2.0/1.1 ports
7. 1 x RJ-45 port
8. 3 x audio jacks

1. iTE^® I/O Controller Chip

1. Voltage detection
2. Temperature detection
3. Fan speed detection
4. Overheating warning
5. Fan fail warning
6. Fan speed control
   * Whether the fan speed control function is supported will depend on the fan you install.